Dan Hillman Named Engineering VP at Transmeta

Transmeta Corp. of Santa Clara, Calif., a developer of computer, microprocessor and semiconductor technologies, announced that Dan Hillman has joined its executive team as vice president of engineering. "Dan brings to Transmeta over 35 years of experience across a variety of sectors including IP (intellectual property) licensing, chip design, and electronic design automation (EDA), all of which are applicable to Transmeta as we work to promote the adoption of our LongRun2 technologies by a broader market," said President and CEO Les Crudele. Most recently, Hillman served as vice president of engineering for Mosaid Technology, a position he previously held at Virtual Silicon, acquired by Mosaid in 2005. Before that, he served as vice president of engineering for inSilicon, a provider of communications semiconductor IP, which was acquired by Synopsys. Hillman also served as Corporate Application Group director for the Physical Synthesis business unit of Synopsys for eight years and spent 11 years at Apple Computer as a hardware manager, where he was directly involved in the design of the Apple IIGS and Macintosh computers and also led a team that developed the IEEE 1394 (Firewire) serial bus. Hillman began his career at RCA and Zilog and holds a BS in electrical engineering from Purdue University.