Chipmakers Collaborate at UAlbany

Flanders, N.J.-based Rudolph Technologies Inc., a high-performance process control metrology, defect inspection and data analysis systems manufacturer, has joined the Three-Dimensional Interconnect Program at the College of Nanoscale Science and Engineering of the University at Albany, which is sponsored by Sematech Inc. of Austin, Texas. The partnership with the global consortium of chipmakers is a continuation of a collaborative effort in process characterization, with a focus on 3-D integrated circuits processing and on enhancing process control of through-silicon vias manufacturing. This is the second year that the New Jersey company will serve as a member of the consortium. Its inspection and metrology technologies will be applied to multiple projects, including depth and CD metrology, metallization void detection, stacked wafer alignment, wafer-edge defect detection and bump height coplanarity.