3M, Suss Team for Wafer Bonding

3M, supplier of advanced materials to the semiconductor industry, and Suss MicroTec, a maker of semiconductor processing equipment, announced an agreement to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultrathin wafers required for 3-D packaging. As part of this nonexclusive agreement, Suss MicroTec becomes an authorized equipment supplier for the 3M WSS and will manufacture and sell XBC300 and CBC300 wafer bonders configured to use 3M’s WSS materials including 3M Liquid UV-curable adhesive and light-to-heat conversion coating.