Wafer Bonding Shipment

Wafer bonding and lithography equipment supplier !%EV Group%! of St. Florian, Austria, has shipped two wafer bonding systems to the University of Michigan’s Lurie Nanofabrication Facility, a center for microelectromechanical systems (MEMS) and microsystems research and a member of the National Nanotechnology Infrastructure Network. The new systems will provide high-force wafer bonding capabilities to increase the level of the university’s MEMS research efforts.





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