Circular VCSEL
!%VI Systems GmbH%! of Berlin has released the
first circular chip arrays of its vertical-cavity surface-emitting laser (VCSEL)
designed for wire- and flip-chip bonding. With seven channels for data rates of
up to 5 Gb/s per channel, the VCSEL delivers an operating wavelength of 850 nm and
is available in a ringlike 6 + 1 channel configuration with one emitter in the center.
It is suitable for short- and very short reach optical receivers and transceiver
modules used in optical communications networks as well as in chip-to-chip optical
interconnects in the computer industry. VI Systems is a fabless developer and manufacturer
of optoelectronics components for communication, industrial and consumer applications.
LATEST NEWS
- Exail Signs LLNL Contract, Partners with Eelume
Apr 26, 2024
- Menlo Moves U.S. HQ: Week in Brief: 4/26/2024
Apr 26, 2024
- Optofluidics Platform Keys Label-, Amplification-Free Rapid Diagnostic Tool
Apr 25, 2024
- DUV Lasers Made with Nonlinear Crystals Enhance Lithography Performance
Apr 25, 2024
- Teledyne e2v, Airy3D Collaborate on 3D Vision Solutions
Apr 24, 2024
- One-Step Hologram Generation Speeds 3D Display Creation
Apr 24, 2024
- Innovation Award Winners for Laser Technology Honored in Aachen
Apr 23, 2024
- Intech 2024: AI Arrives on the Shop Floor
Apr 22, 2024