Photonics Spectra BioPhotonics Vision Spectra Photonics Showcase Photonics Buyers' Guide Photonics Handbook Photonics Dictionary Newsletters Bookstore
Latest News Latest Products Features All Things Photonics Podcast
Marketplace Supplier Search Product Search Career Center
Webinars Photonics Media Virtual Events Industry Events Calendar
White Papers Videos Contribute an Article Suggest a Webinar Submit a Press Release Subscribe Advertise Become a Member


Atrenta, CEA-Leti Sign Multi-Year 3-D Contract

Atrenta Inc. announced Wednesday that it has signed a multi-year collaboration agreement with CEA-Leti, the Electronics and Information Technology Laboratory of the French Atomic Energy Commission.

The joint development work will take place at the company’s R&D center in Grenoble.

The work under the collaboration agreement will focus on two primary development areas. The first will address techniques to analyze, predict and reduce the power consumption of advanced microelectronic devices at the early stages of design, including the architectural and register transfer language (RTL) levels. The second aspect addresses the analysis and partitioning of 3-D stacked die devices, also at the architectural and RTL levels.

“3-D design and advanced power reduction represent two areas of significant interest for the microelectronics community that CEA-Leti serves,” said Dr. Ahmed Jerraya, head of design programs and research director at CEA-Leti.

Atrenta provides Early Design Closure solutions to improve design efficiency throughout the IC design flow.

For more information, visit: www.atrenta.com 

Explore related content from Photonics Media




LATEST NEWS

Terms & Conditions Privacy Policy About Us Contact Us

©2024 Photonics Media