Semiconductor Packaging Agreement

To provide increased performance and smaller-size portable electronics and other advanced systems, CEA-Leti has signed a multiyear agreement with Shinko Electric Industries Co. Ltd. to develop advanced semiconductor packaging technology. The work will focus on silicon interposers. The passive intermediate layers can be used in several ways to boost the usable performance and reduce the footprint of advanced silicon chips. The work will be done at Leti’s headquarters in Grenoble, France. Shinko, of Nagano, Japan, developed the previous 3-D silicon packaging technologies. The joint venture with Leti will allow the company to accelerate development for mass production of the substrate.