Smaller Pump Laser Packaging Announced
An agreement between optical communications products suppliers !%Oclaro Inc.%! of San Jose, Calif., and 3SPGroup of Nozay, France, marks the biggest change in industry standards for small form factor pump laser packaging in 15 years, reducing the packaging by 70 percent, the companies say. The new 10-pin butterfly package replaces the current standard 14-pin format and is about 30 percent its size. It will be backwardly compatible with legacy applications and will allow customers to develop compact amplifiers with lower costs and reduced space requirements in network equipment, the companies say.
LATEST NEWS
- Exail Signs LLNL Contract, Partners with Eelume
Apr 26, 2024
- Menlo Moves U.S. HQ: Week in Brief: 4/26/2024
Apr 26, 2024
- Optofluidics Platform Keys Label-, Amplification-Free Rapid Diagnostic Tool
Apr 25, 2024
- DUV Lasers Made with Nonlinear Crystals Enhance Lithography Performance
Apr 25, 2024
- Teledyne e2v, Airy3D Collaborate on 3D Vision Solutions
Apr 24, 2024
- One-Step Hologram Generation Speeds 3D Display Creation
Apr 24, 2024
- Innovation Award Winners for Laser Technology Honored in Aachen
Apr 23, 2024
- Intech 2024: AI Arrives on the Shop Floor
Apr 22, 2024