Escatec Appoints Micro-assembly Expert to Head MOEMS Facility

Wolfgang Plank, the R&D project manager of electronics manufacturing services provider Escatec, was appointed head of the company’s MOEMS (micro-optic electronic manufacturing services) facility.

The new role takes advantage of Plank’s career-long focus on LEDs, micro-optics and micro-assembly. He has developed products for companies such as Intel and Ivoclar Vivadent, ranging from a cooling plate for electronic chips through a piezoelectric system to calibrate IR lasers for satellites, to a blue LED device for curing dental materials.

The MOEMS facility features an ISO Class 7 cleanroom with capabilities such as chip-on board (die and wire bonding), encapsulation, solder flip chip, ball grid array and micro-optics assembly. The cleanroom also has ISO Class 5 sections for ultraclean assembly.

“It is very unusual for a contract manufacturer to have invested in the expensive cleanroom facilities required for MOEMS,” Plank said. “Micro-assembly is clearly the way of the future as electronics continues to shrink, especially in, for example, implantable medical devices and LED/OLED lighting.”

For more information, visit: www.escatec.com