Tessera Technologies Settles Suit with ASE

Tessera Technologies has settled its suit against Advanced Semiconductor Engineering Inc. (ASE), and the pair has entered into a technical collaboration agreement.

The lawsuit, originally filed in 2006, named several companies including ASE, alleging “breach of contract and/or patent infringement” relating to the manufacture, use, sale and importation of packaged semiconductor components and assemblies.

Under terms of the settlement, ASE will pay Tessera a total of $30 million over the next several years. The two companies have now decided to collaborate on the development of technologies and products.

“With our companies’ mutual technology capabilities and innovations, there is much we can do together to produce value for the industry,” said Tom Lacey, CEO of Tessera.

ASE Chief Operating Officer Tien Wu, Ph.D., agreed, adding that “both ASE and Tessera share the view that technology engagement is in the best interests of our customers and shareholders.”

For more information, visit: www.ir.tessera.com