Rudolph Receives Lithography Order

Rudolph Technologies Inc. said it has received an order for its JetStep lithography system from an outsourced assembly and test facility. The customer's name and financial terms of the order were not disclosed.

Selected for the industry’s first panel manufacturing line, the JetStep S Series will be used for next-generation fan-out processing on rectangular panels.

JetStep S Series lithography system. Courtesy of Rudolph Technologies.

“We view the move from reconstituted wafers to chips-on-panels as a logical and necessary transition in the advanced packaging industry as product volumes increase,” said Mike Plisinski, Rudolph CEO.

The system handles rectangular glass or organic substrates up to 700 mm and is equipped with on-the-fly autofocus and magnification compensation.

”We have an established market presence in both fan-out wafer level packaging and radio frequency devices, which we believe will be transitioning to glass panel interposers,” Plisinski said.

Rudolph Technologies designs and manufactures defect inspection, lithography, process control metrology and process control software used by semiconductor and advanced packaging device manufacturers worldwide.