Vision Systems Planned for Chip Bonding

Cognex Corp. of Natick, Mass., announced that it ahs received a $13 million purchase order for machine vision systems from Tokyo-based Shinkawa ltd. It follows a $6 million order placed by the company in May. Delivery of the order is scheduled to begin in October.

Shinkawa, a manufacturer or wire-, tape- and die-bonding equipment for the semiconductor industry, will integrate the vision systems into its product line. The systems will guide and monitor the bonding of semiconductor die to lead frames.