COSTA MESA, Calif., June 14 -- Irvine Sensors Corp. has received approximately $1.3 million of additional funding for the development of a 3-D imaging (3DI) integrated circuit to interpret reflected signals from laser flashes. A preliminary demonstration of the 3DI chip supported Irvine's bid for the recently announced Jigsaw System award. Jigsaw is designed to enhance combat target detection and identification by use of laser imaging. Irvine's approach involves the stacking of 3DI chips that can operate at ultrahigh speeds to enhance performance achievable with the Jigsaw concept. 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