SAN JOSE, Calif., July 11 -- The Advanced Packaging and Interconnect Alliance (APiA), a group of semiconductor equipment and process technology suppliers, has announced an agreement to work with ACE Semiconductor to provide a 200 mm advanced packaging process line in Shanghai, China. The process line is scheduled for installation in the ACE Shanghai facility in the fourth quarter of 2002. The process line will provide ACE with advanced packaging equipment technology to enhance its position in the wafer-level chip scale packaging market. The APiA said it will use the ACE facility and a share of the line capacity as a development and demonstration center to support its initiative to provide advanced packaging solutions to China.