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Optoelectronics Packaging Facility to Open in Scotland

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ATLANTA, March 25 -- Scotland's role in the global optoelectronics industry will be given a boost with a £4.2 million ($6.75 million) facility for packaging complex optoelectronic chips. Plans for the new facility, which will be located in Livingston, Scotland, and begin operating this summer, were announced this week by the Scottish Optoelectronics Association at the Optical Fiber Communication 2003 conference in Atlanta. The center will specialize in developing processes to arrange delicate circuitry in the protective packaging that allows optoelectronic devices to interface and connect to...Read full article

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    Published: March 2003
    6.75 million facility for packaging complex optoelectronic chipsCommunicationsglobal optoelectronics industryindustrialNews & FeaturesScotland

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