Daily News Briefs
A report by SEMI and TechSearch International forecasts that the market for semiconductor packaging materials will grow from $7.9 billion in 2003 to $11.7 billion by 2008. The laminate substrates segment of the market, worth $2 billion globally in 2003, is leading sector growth and is projected to overtake leadframes as the largest semiconductor packaging material segment in 2005, according to the report, "Global Semiconductor Packaging Materials Outlook." For more information, visit: www.semi.org . . . Dalsa Corp. announced it has received an order worth $1.3 million from an Asian supplier of flat-panel display inspection equipment. Dalsa will deliver high-performance electronic cameras in the second quarter of 2004, with the potential for subsequent production orders. . . . GE's Imagination Nation exhibit, which will be on display until March 19 at Union Station in Washington, D.C., showcases technologies including Lightspeed, a cutting-edge medical imaging system that produces ultra high-resolution pictures of internal anatomy; the EntryScan³ explosives detection system; the smart Roadster, which features a polycarbonate film that is expected to replace paint on cars; The GE90 commercial jet engine; The GE Evolution, a fuel-efficient diesel locomotive; and the H-Turbine, a new breed of high-efficiency power systems. General Electric Co. told investors gathered at the exhibit yesterday that it expects to boost spending on new technologies to more than $5 billion in 2006, from $4 billion last year. Those figures include research and development, CFO Keith Sherin said.
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