Daily News Briefs
Indium Corp., a supplier of electronics assembly materials, has appointed Paul Salmon as director of marketing in Europe. Salmon has extensive experience in soldering products and sales-channel development and in marketing consumable products in the region. He will initially oversee the transition to Pb-free soldering at printed circuit assembly companies and further develop Indium's position as a supplier of soldering products in Europe. . . . Dalsa Corp. announced it has received a $1.6 million contract from a manufacturer of semiconductor wafer inspection systems to develop high-performance digital cameras that will be used to inspect semiconductor wafers at extremely high speeds and low light levels. The project will be completed over the next 15 months, after which it will be available for follow-on production.
- Metal used in components of the crystalline semiconductor alloys indium gallium arsenide (InGaAs), indium gallium arsenide phosphide (InGaAsP), and the binary semiconductor indium phosphide (InP). The first two are lattice-matched to InP as the light-emitting medium for lasers or light-emitting diodes in the 1.06- to 1.7-µm range, and the last are used as a substrate and cladding layer.
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