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News Briefs
Oct 2005
The microelectronics division of San Diego-based Jmar Technologies Inc., a developer of laser-based equipment for imaging, analysis and fabrication at the nanoscale, has been awarded a $603,000 contract to upgrade the Department of Defense's DMEA (Defense Microelectronics Activity) program's semiconductor fab process at the Advanced Reconfigurable Manufacturing for Semiconductors foundry in Sacramento from 5-in. silicon wafers to 6-in. wafers over the next six months. The DMEA program was established to prevent the microelectronics used in US military weapon systems from becoming obsolete before the weapons do.    . . .    AltaSens Inc. of Thousand Oaks, Calif., a supplier of high-performance, high-definition CMOS image sensors, has named Patrick Quinn as its CEO and newest board member. Prior to joining AltaSens, Quinn founded Wave7 Optics, a provider of fiber-to-the-premises equipment, and over the course of five years served as its vice president of business development, vice president of product management and vice president of integrated technology.    . . .    Silicon Genesis Corp. (SiGen) of San Jose, Calif., a provider of silicon-on-insulator process technology used in the production of engineered wafers with nanotechnology applications, has entered into an intellectual property license agreement with Shin-Etsu Chemical Co. Ltd. of Tokyo, Japan, under which Shin-Etsu will have rights to SiGen's NanoTec suite of technologies and will purchase SiGen's proprietary equipment. Shin-Etsu will use the licenses to manufacture layer transfer substrates for optoelectronic applications used in the HDTV, computer and handheld consumer appliance markets.

A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
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