Switzerland-based Synova, a maker of water-jet-guided laser technology used in wafer dicing and wafer-edge grinding, has appointed Sean Green as manager of technical sales and support for the Asia-Pacific region. Green will oversee the sales and service activities of all the company's employees and agents in the region, including those in Japan, China, Korea, Taiwan, Singapore, Malaysia, Thailand, India and the Philippines. Prior to joining Synova, Green spent approximately five years with a Japanese manufacturer of dicing machines, most recently as an assistant manager for the overseas sales group. . . . L-3 Communications of New York announced that Arthur A. Morrish has been appointed to the newly created position of vice president and chief technology officer for the products group. Morrish worked for the Defense Advanced Research Projects Agency (DARPA) for the past eight years, most recently as director of the Tactical Technology Office. L-3 makes intelligence, surveillance and reconnaissance systems and high technology products primarily for communication, guidance and navigation. . . . SensorsGov is an event for those in the sensors industry related to military fields, including aircraft and guided missiles, transportation, telecommunications, power plants and avionics. It is being held from Dec. 6-8 at the Hampton Roads Convention Center in Hampton, Va., and is designed to provide a platform for sensors-related companies to exchange ideas, ask questions and explore collaborative opportunities for sensor research and development with US government and military organizations. Keynote speakers include David G. Boyd, deputy director, Systems Engineering and Development Science and Technology Directorate, US Department of Homeland Security; and Bruce Holmes, director, Strategic Partnership, Planning & Management Office, NASA Langley Research Center. Register online at: www.sensorsgov.com
- A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
MORE FROM PHOTONICS MEDIA