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DuPont and Fraunhofer Collaborate

Photonics Spectra
Jun 2006
DuPont Semiconductor Packaging & Circuit Materials of Research Triangle Park, N.C., has formed an alliance in which Fraunhofer Institute for Reliability and Microintegration IZM of Berlin will assist in refining and optimizing the integration of DuPont’s line of materials into wafer-level and chip-scale packaging.

The agreement will enable the company to develop and demonstrate process and materials integration in areas such as bond pad redistribution, wafer bumping and bonding, and process aids for cleaning and wafer protection during processing. Additionally, Fraunhofer will support DuPont’s product development efforts and will provide training of personnel.

BusinessDuPont Semiconductor Packaging & Circuit Materialslight speedmaterialswafer bumpingwafer-level

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