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Suss Bonding System Chosen for Infotonics' MEMS Center

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Microelectromechanical systems (MEMS) wafer-bonding solutions provider Suss MicroTec of Munich, Germany, announced today that Infotonics has selected the company's ABC200 wafer-bonding cluster tool and FC150 device bonder for its MEMS packaging lab. "The ABC200 will allow automated precision alignment, cleaning, bonding and inspection all in one system. The ABC200 cluster tool modularity allows us to run a variety of bonding processes for both R&D and pilot production," said Nancy Stoffel of the Infotonics Technology Center. The FC150 provides development and pilot production capabilities...Read full article

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    Published: March 2007
    Glossary
    flip chip
    An optical switch that controls conduction paths into and out of a junction in fiber optic and integrated optical circuits.
    microelectromechanical systems
    Refers to micron-size complex machines that have physical dimensions suitable for the fabrication of optical switches for use in state-of-the-art communications networks.
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    The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
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