Infotonics Center Employs Suss MicroTec Tools
The Infotonics Technology Center of Canandaigua, N.Y., has selected Suss MicroTec America Inc.’s bonding systems for use in its microelectromechanical systems (MEMS) packaging laboratory to provide R&D and pilot production capabilities. The ABC200 modular wafer bonding cluster tool will allow automated precision alignment, cleaning and bonding in one system, and, for flip chip processes, the FC150 device bonder provides configurations from manual to full automation. The Suss MicroTec Wafer Bonder Div. is based in Waterbury Center, Vt. Infotonics focuses on the design, simulation, packaging, testing and metrology of MEMS and micro-optoelectromechanical systems.
- The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
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