Show Offers Latest in Micro- and Nanoelectronics
SAN FRANCISCO, July 13, 2007 -- From the latest on solar and renewable energy to the growing importance of semiconductor test, Semicon West 2007 will offer the latest news and information -- as well as the newest products and technologies -- focused on the future of micro- and nanoelectronics design and manufacturing when it takes place July 16-20 at the Moscone Center in downtown San Francisco.
With more than 1250 exhibiting companies demonstrating an estimated 500 new products and technologies, over 30 hours of free technical presentations, and many other programs, short courses and workshops, Semicon West 2007 is the largest exhibition of the semiconductor industry in North America.
Whether you're looking for technical training, market data, or insight into the current trends and issues shaping the industry, you'll find it at Semicon West. Information provided during its programs, events, exhibits and technical presentations will cover industries and market segments including: semiconductor manufacturing equipment and materials, wafer processing, nanoelectronics applications and manufacturing, microelectromechanical systems and microsystems (MEMS/MST) applications and manufacturing, assembly and packaging, energy technologies, fuel cells, and solar/photovoltaic systems.
A featured program of the event will be "Next Generation Fab: Defining 300-mm Prime." This special program, free to all attendees, will discuss the advances in manufacturing processes, tools and productivity known as "300-mm prime." Will it push out or eliminate the need for larger wafers? Join the debate July 19 from 8:30–10 a.m. Speakers include Dave Gross, AMD; Iddo Hadar, Applied Materials; Chris Hofmeister, Brooks Automation; Shige Kobayashi, Renesas Technology; and Elizabeth Williamson, IBM.
A focal point for attendees will be the free TechXPOTS ("tech spots"), three "shows within the show" that feature exhibits, technical presentations, special displays and other attractions focused around specific technologies and themes.
The Emerging Technologies and Markets TechXpot will explore the future of electronics manufacturing, reaching in the world of nanotechnology, microsystems and renewable energy, with its exhibits, technical presentations and displays.
At the Test, Assembly, and Packaging TechXPOT, you’ll see and hear leading industry experts and technologists explore the current trends and challenges in test, assembly, and packaging.
The technical presentations at the Challenges in Device Scaling TechXPOT will explore the critical technologies that are enabling continued progress along the Moore’s Law curve. As microelectronics enter the nanotechnology era and as Moore’s Law (the 42-year-old prediction that the number of transistors on a chip doubles about every two years) is pushed to its limits and beyond, the technologies involved in scaling devices to 32 nm and below remain at the core of future semiconductor design and manufacturing.
Also showcased at different TechXPOTS stages will be the 19 jury-selected winners of the 2007 Technology Innovation Showcase, designed to give companies an opportunity to present their high-impact new products to the large and enthusiastic audience that attends Semicon West. The winners will represent a wide array of solutions and advances.
New this year is the two-day Exhibitor Product Showcase, where participating businesses will demonstrate new and exciting products and technologies for visitors. Participating businesses include: Renishaw (high-accuracy linear encoder), Sarnoff (breakthrough imaging solutions), Trek (electrostatic measurement techniques and ESD management, Point Grey Research (high-performance imaging with 1394b cameras), Lighthouse Worldwide Solutions (optical particle counters for air, liquid and gas monitoring), and Disco (laser singulation to meet current- and next-generation packaging challenges).
Also for the first time this year, the International Technology Roadmap for Semiconductors (ITRS) Summer Public Conference will take place during the five-day event. Participants in this conference (additional fee required) will hear the latest developments in the ITRS and interact with the technologists driving the future of semiconductors.
Semicon West is presented by SEMI (Semiconductor Equipment and Materials International), which represents the semiconductor, display, MEMS and related industries.
SEMI has partnered with SPIE and PTI Seminars to provide attendees access to valuable technical education during numerous short courses and workshops, most of which are being held at the San Francisco Marriott Hotel. The short course and workshops are designed to appeal to those new to the semiconductor manufacturing process and seasoned experts, through course titles such as: "Introduction to Microlithography: Theory, Resolution Enhancement and Future Trends;" "The Limits of Optical Lithography;" "Best Practices in Failure Avoidance;" and "Advanced Wet Etching and Cleaning."
The SEMI Market Symposium, co-sponsored by SEMI and Gartner Dataquest, provides a midyear market update as well as a forum to discuss pertinent business issues. Market forecasts and analysis for the semiconductor, capital equipment and semiconductor materials industries will be presented; featured speaker is Steve Longoria, vice president, Semiconductor Platforms IBM Systems and Technology Group.
The panel discussion "The Next Big Outsourcing Thing: Process Development and Modules" will feature Farah Tuten, Freescale; Bert Bruggeman, SVTC; Tim Tobin, Entrepix; Steve Swanson, Innovion; and Craig West, Toppan Photomask.
For more information or to register, visit: www.semiconwest.org/index.htm
- A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
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