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Manufacturing Microelectronics Using ‘Lase-and-Place’

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Lasers enable further miniaturization in electronics by placing tiny components directly into circuit boards.

Scott A. Mathews, Nicholas A. Charipar, Kristin Metkus and Alberto Piqué, US Naval Research Laboratory

Microelectronic circuits traditionally are fabricated by placing packaged components, such as integrated circuits and surface-mount devices, on the surface of a circuit board and connecting the components together. As the demand for miniaturization has grown, however, the size of these packaged components has become a limiting factor. There are various ways to address this limitation; for instance, application-specific integrated circuits, which eliminate the need for individual components. Instead, the entire circuit is fabricated in one fell swoop and then packaged. However, development...Read full article

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    Published: October 2007
    energyFeaturesindustrialintegrated circuitsmicroelectronic circuitsSensors & Detectorssufrace-mount devices

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