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Photonics Spectra
Oct 2007
A manufacturer of silicon-based packaging products for electronic devices, Hymite A/S has launched a Web site to assist integrated circuit (IC) manufacturers who are seeking package size and cost reductions for a variety of applications. The portal explores silicon packaging, produced at wafer level using standard IC techniques, as a means to further miniaturize IC components for use in LED, radio-frequency and microelectromechanical systems. It describes how the company’s silicon packaging offers suitable thermal properties for LEDs and how its wafer-level production provides a hermetic seal for contaminant-susceptible designs. It details the products and technology, and it includes downloadable data sheets and application notes.

BreakthroughMediaHymite A/SIC componentsNew Mediasilicon-based packaging

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