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Fraunhofer, Plan Optik Sign Patent Agreement

Photonics Spectra
Dec 2008
In Germany, Plan Optik AG of Elsoff, a wafer manufacturer, has signed an agreement with Fraunhofer Institute for Silicon Technology in Itzehoe for the exclusive use of patented production processes, specifically the optimized manufacture of high-quality glass microlenses and the hermetic glass encapsulation of microelectromechanical systems with simultaneous electrical vertical interconnect access. Under terms of the agreement, Plan Optik will use borosilicate glass with a refractive index of 1.474 at 589 nm.

glass microlenseshermetic glass encapsulationmicroelectromechanical systemsPatent Newssilicon technologySlices from the Breadboard

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