Tessera Technologies Inc. of San Jose, Calif., has licensed its µPILR interconnect platform to Kinsus Interconnect Technology Corp. of Hsinwu Hsiang, Taiwan. The µPILR interconnect platform improves and simplifies interconnections within semiconductor packages, substrates, printed circuit boards and other electronic components. Under the terms of agreement, Kinsus will manufacture and sell their IC package substrates based on the µPILR technology.