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Chipmakers Collaborate at UAlbany
Apr 2009
Flanders, N.J.-based Rudolph Technologies Inc., a high-performance process control metrology, defect inspection and data analysis systems manufacturer, has joined the Three-Dimensional Interconnect Program at the College of Nanoscale Science and Engineering of the University at Albany, which is sponsored by Sematech Inc. of Austin, Texas. The partnership with the global consortium of chipmakers is a continuation of a collaborative effort in process characterization, with a focus on 3-D integrated circuits processing and on enhancing process control of through-silicon vias manufacturing. This is the second year that the New Jersey company will serve as a member of the consortium. Its inspection and metrology technologies will be applied to multiple projects, including depth and CD metrology, metallization void detection, stacked wafer alignment, wafer-edge defect detection and bump height coplanarity.

The science of measurement, particularly of lengths and angles.
The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
chipmakersCollege of Nanoscale Science and EngineeringCoplanaritydefect detectionEmploymentengineeringGlobal Consortiumindustrialinspectionintegrated circuitsInterconnect ProgramMetallization Void DetectionmetrologyNews BriefsphotonicsPhotonics Tech BriefsRudolph Technologies Inc.SematechUniversity at AlbanyWafers

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