Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn Comments

ITC: Tessera Patents Infringed

Photonics.com
May 2009
The International Trade Commission (ITC) has ruled in favor of electronic packaging solutions provider Tessera Technologies Inc., finding that its patents are valid and have been infringed by certain chip makers, the San Jose, Calif.-based company announced Wednesday. The finding overrules a December 2008 determination by an ITC judge in favor of the semiconductor companies. On Wednesday, the ITC issued an order banning the importation of infringing electronic devices that use Tessera’s patented technology and issued a cease and desist order against Motorola, Qualcomm, Freescale and Spansion to stop them from selling infringing items out of their US inventories. “This is a powerful victory for Tessera and the rights of patent holders everywhere,” said Henry R. Nothhaft, president and CEO of Tessera, adding that the decision “sends a positive message to other innovators that depend on their patent rights to protect their inventions against would-be infringers.” The respondents in the Wireless ITC action were ATI Technologies, Freescale Semiconductor, Motorola, Qualcomm, Spansion Inc., Spansion LLC and ST Microelectronics. Tessera asserted infringement of two US patents, No. 6,433,419 and No. 5,852,326, concerning face-up semiconductor chip assemblies. In its own statement, San Diego-based Qualcomm said it was disappointed with the ruling but had prepared for an adverse result by shifting its supply of chips for the US market to Amkor. Amkor has been a Tessera licensee for some time and has long been one of Qualcomm’s major packaging suppliers. Qualcomm pointed out in its release that the patents in question will expire in September 2010 and that the claims asserted by Tessera are currently being reexamined by the US Patent & Trademark Office. The patent office has issued final rejections of all of the asserted claims in both patents as invalid based on prior art; Tessera is contesting the final rejections, and the process remains ongoing.


GLOSSARY
chip
1. A localized fracture at the end of a cleaved optical fiber or on a glass surface. 2. An integrated circuit.
photonics
The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
chipclaimselectronicEmploymentFreescaleinfringedinfringinginvalidITCMotorolananoNews BriefsorderpatentPatent and Trademark OfficepatentedphotonicsPhotonics Tech BriefsQualcommrightssemiconductorSpansionST MicroelectronicsTesseravalidwireless

Comments
Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2017 Photonics Media
x We deliver – right to your inbox. Subscribe FREE to our newsletters.