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SensorDymanics Enters Gyroscope Market
Apr 2010
GRAZ, Austria, April 15, 2010 — SensorDymanics, a micro and wireless semiconductor products manufacturer, has launched its two- and three-axis gyroscopes.

Its patented sensor elements are fabricated by the PSM-X2 MEMS process, which is available for 8-in. wafers. They can be used as standalone components or combined with a 3-D accelerometer.

The company will offer the 2- and 3-D MEMS gyroscopes as standalone products for use in industry, automation engineering, medicine and navigation applications. Additionally, an automotive version for the -40 to 125 °C temperature range that is certified to AEC-Q1000 is in the works.

Produced using its patented dual-cavity technology, the 3-D device will be integrated with a 3-D accelerometer to offer a complete inertial measurement unit with six degrees of freedom on a few square millimeters of chip space, said the company.

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1. A localized fracture at the end of a cleaved optical fiber or on a glass surface. 2. An integrated circuit.
See fiber optic gyroscope; ring-laser gyroscope; micro-optic gyroscope.
1. A generic term for detector. 2. A complete optical/mechanical/electronic system that contains some form of radiation detector.
A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
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