Wafer Bonding Shipment
Wafer bonding and lithography equipment
supplier EV Group of St. Florian, Austria, has shipped two wafer bonding systems
to the University of Michigan’s Lurie Nanofabrication Facility, a center for
microelectromechanical systems (MEMS) and microsystems research and a member of
the National Nanotechnology Infrastructure Network. The new systems will provide
high-force wafer bonding capabilities to increase the level of the university’s
MEMS research efforts.