VI Systems GmbH of Berlin has released the
first circular chip arrays of its vertical-cavity surface-emitting laser (VCSEL)
designed for wire- and flip-chip bonding. With seven channels for data rates of
up to 5 Gb/s per channel, the VCSEL delivers an operating wavelength of 850 nm and
is available in a ringlike 6 + 1 channel configuration with one emitter in the center.
It is suitable for short- and very short reach optical receivers and transceiver
modules used in optical communications networks as well as in chip-to-chip optical
interconnects in the computer industry. VI Systems is a fabless developer and manufacturer
of optoelectronics components for communication, industrial and consumer applications.