!%VI Systems GmbH%! of Berlin has released the first circular chip arrays of its vertical-cavity surface-emitting laser (VCSEL) designed for wire- and flip-chip bonding. With seven channels for data rates of up to 5 Gb/s per channel, the VCSEL delivers an operating wavelength of 850 nm and is available in a ringlike 6 + 1 channel configuration with one emitter in the center. It is suitable for short- and very short reach optical receivers and transceiver modules used in optical communications networks as well as in chip-to-chip optical interconnects in the computer industry. VI Systems is a fabless developer and manufacturer of optoelectronics components for communication, industrial and consumer applications.