Remtec Adds New Plating Line
NORWOOD, Mass., Dec. 21, 2010 — Remtec Inc. has completed the installation of a state-of-the-art gold-tin plating line and associated process control and quality assurance equipment.
The new line provides the company with complete integrated in-house ability to produce high-quality laser diode submounts with Zero Pullback copper metallization and selective gold-tin finish, as well as ceramic substrate packages and packaging components with gold-tin finish.
Remtec’s new gold-tin plating line provides completely integrated in-house ability to economically produce high-quality laser diode submounts with Zero Pullback copper metallization and selective gold-tin finish. (Photo: Remtec)
The gold-tin plating process production, statistical process controls and quality control equipment have raised the company’s quality levels. Its quality control equipment includes x-ray fluorescence, energy dispersive x-ray fluorescence and a spectrophotometer, which allows for fast, accurate control and record of critical parameters such as gold-tin composition and thickness distribution.
Its plating line includes gold-tin alloys with compositions varying from 72/28 to 80/20, with thickness specified between 3 and 50 µm. Substrates are available with multiple metallization techniques and selective plating options that permit both silver thick-film and TiW thin-film seed layers of various thicknesses, plated copper from 5 to 75 µm and NiAu finish with gold thickness from 0.1 to 2.5 µm. Ceramic and copper surface finishes also are available and can be held to <1 µm.
Remtec provides custom and semicustom ceramic packaging based on plated copper and thick film (PCTF) technology.
For more information, visit: www.remtec.com