Rudolph Receives First Order for Macro Defect Inspection System
FLANDERS, N.J., June 15, 2011 — Rudolph Technologies Inc. has announced that it has received from an IC manufacturer the first order for its NSX 320 automated macro inspection system, designed for advanced packaging processes that use through silicon vias (TSV) to connect multiple die in a single package.
The system provides critical inspection capabilities for edge-trimming metrology, wafer alignment during bonding processes, sawn wafers on film frames and other TSV-related processes. It incorporates proprietary XSoft system software capabilities — including high-speed staging, on-the-fly image capture and a range of sensor and objective options — for flexibility and ease of use.
The company’s NSX series inspection tools deliver production-proven, high-throughput macro defect inspection for back-end integrated circuit manufacturing processes. Macro defects (0.5 µm and larger) can be created during wafer manufacturing, probing, bumping, dicing or by general handling, and have an impact on the quality of a microelectronic device and the yield of the manufacturing process. In addition, the tools quickly and accurately detect yield-inhibiting defects to provide quality assurance and process information.
Rudolph Technologies designs, manufactures and supports defect inspection, process control metrology, and data analysis systems and software used by semiconductor device manufacturers.
For more information, visit: www.rudolphtech.com