Rudolph Wins Order for Inspection System
Rudolph Technologies
Inc. has received from an integrated circuit manufacturer the first order for its
NSX 320 automated macro defect inspection system, designed for advanced packaging
processes that use through silicon vias (TSVs) to connect multiple die in a single
package. The system provides inspection capabilities for edge-trimming metrology,
wafer alignment during bonding processes, sawn wafers on film frames and other TSV-related
processes. It incorporates proprietary XSoft system software capabilities, including
high-speed staging, on-the-fly image capture, and a range of sensor and objective
options.
/Buyers_Guide/Rudolph_Technologies_Inc/c12952
Published: September 2011
Glossary
- metrology
- Metrology is the science and practice of measurement. It encompasses the theoretical and practical aspects of measurement, including the development of measurement standards, techniques, and instruments, as well as the application of measurement principles in various fields.
The primary objectives of metrology are to ensure accuracy, reliability, and consistency in measurements and to establish traceability to recognized standards. Metrology plays a crucial role in science, industry,...
Americasautomated macro inspection systembonding processesbumpingBusinessdata analysis systemdefect detectiondefect inspectiondicingedge-trimming metrologyfilm framesIC manufacturerimage captureImaginginspection systemintegrated circuit manufacturinglight speedmacro defect inspectionmetrologymicroelectronicsNew JerseyNSX 320NSX seriesobjectivespackaging processesprobingprocess control metrologyRudolph Technologiessawn waferssemiconductorsSensors & DetectorsSoftwarestagingTest & Measurementthrough silicon viasTSVwafer alignmentwafer manufacturingXSoft system software