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Lasers Enable High-Volume Handling of Microelectronics

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FARGO, N.D., Oct. 27, 2011 — A contactless laser-assisted packaging technology for high-throughput, low-cost assembly of ultrathin semiconductor chips onto rigid and flexible substrates has recently been developed. The technology, called laser-enabled advanced packaging (LEAP), has the potential to facilitate high-volume handling, placement and interconnection of microelectronic components that are smaller than ever before. The comprehensive wafer-to-product electronic packaging technology allows semiconductor chips less than 50 µm thick to be rapidly placed and fixed at specific locations and orientations...Read full article

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    Published: October 2011
    Glossary
    microelectromechanical systems
    Refers to micron-size complex machines that have physical dimensions suitable for the fabrication of optical switches for use in state-of-the-art communications networks.
    Aaron ReinholzAmericasCenter for Nanoscale Science and EngineeringCNSEdefenseelectronic packagingflexible substratesindustriallaser-assisted packaginglaser-enabled advanced packagingLEAPMEMSmicroelectromechanical systemsmicroelectronic componentsNDSUNorth Dakota State UniversityPhotonic Component Mfg. Equip.Photonics Component Mfg. Equip.Research & TechnologyRFID tagsrigid substratesSensors & Detectorsthermomechanical selective laser assisted die transfertmSLADTultrathin semiconductor chipsLasers

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