Altatech Delivers CVD System to Fraunhofer
MONTBONNOT, France, June 25, 2013 — Altatech, a subsidiary of Soitec, has installed its AltaCVD (chemical vapor deposition) system at Fraunhofer Research Institution for Modular Solid State Technology EMFT in Munich for use in depositing polysilicon films for CMOS and MEMS applications.
The reactor system is a multichamber tool designed for plasma-enhanced or high temperature CVD of advanced semiconductor materials using liquid or gaseous precursors. It tightly controls layer thicknesses and achieves precise doping levels.
“Our single-wafer CVD system’s ability to deposit crystalline, polycrystalline and amorphous materials with extremely low defectivity and high uniformity of dopants and film thickness control are key to enabling thin- and thick-film deposition needed for semiconductor and MEMS applications,” said Jean-Luc Delcarri, general manager of Altatech. “Following the release of our advanced CVD systems for front-end and memory processing and the rollout of our deposition tools for TSV (through-silicon-via) isolation and conductive layers, we are now applying our proven technology in depositing polysilicon layers for new applications.”
The repeat order from Fraunhofer EMFT will be used to develop advanced deposition technologies for thin and thick polysilicon layers.
Professor Ignaz Eisele, head of Fraunhofer’s Nano Materials and Silicon Technology Div., said that the CVD system will be used in various research projects with “single-wafer deposition technology in a multichamber platform to develop process integration with high throughput and extremely low level of contamination.”
For more information, visit: www.soitec.com
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