Rudolph to Fulfill $11M Wafer-Level Packaging System Order
WILMINGTON, Mass., July 4, 2016 — Defect inspection, lithography, metrology, and process control software developer Rudolph Technologies Inc. said it has received a multisystem order for its fan-out wafer level packaging (FOWLP) system from an outsourced assembly and test firm in Asia. The order is valued at $11 million.
The order consists of multiple process control inspection systems and a yield-management software suite, and will be deployed into multiple applications including whole wafer inspection, 3D bump metrology and post-saw die inspection. The systems will begin shipping in the second quarter of 2016, with the majority of the order shipping in the second half of 2016.