Craig Ciesla Named VP of Engineering by Kaiam
NEWARK, Calif., July 20, 2016 — Hybrid photonic integrated circuit (PIC) developer Kaiam Corp. has appointed Craig Ciesla vice president of engineering. Ciesla will lead development and engineering teams at the company’s Newark, Calif., and Livingston, Scotland, sites, with a focus on advanced components and packaging for transceivers at 100 and 400 Gb/s and beyond.
Ciesla was CEO and cofounder of Tactus Technology, a venture-backed company that developed a tactile layer that creates dynamic physical buttons for touchscreen devices. He holds a bachelor’s degree and Ph.D. in physics from Heriot-Watt University.