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Oxford Instruments Plasma Technology Receives CS Industry Award

Photonics.com
Mar 2017
YATTON, England, March 22, 2017 — Oxford Instruments Plasma Technology Ltd. has received Compound Semiconductor magazine’s CS Industry Award for High Volume Manufacturing.

The award celebrates the company’s development of silicon carbide (SiC) plasma etch processes delivered through the PlasmaPro100 Polaris systems.

“We are very excited to receive this award, as it recognizes some of the great innovation that is carried out by the people here at Plasma Technology," said Frazer Anderson, strategic marketing and business development director at Oxford Instruments Plasma Technology. The SiC via etch process developed is an important step in producing next-generation radio frequency devices, it gives excellent device performance with the smooth etch sidewalls and low cost of ownership,” 

The awards, now in their fifth year, recognize success and development along the entire value chain of the compound semiconductor industry, from research to completed devices, with a focus on people, processes and products.


GLOSSARY
compound semiconductor
A semiconductor made up of two or more elements, in contrast to those composed of a single element such as germanium or silicon. In a III-V semiconductor, for example, one or more elements having three valence electrons (gallium, for instance) are combined with one or more having five (arsenic).
BusinessOxford Instruments Plasma Technologycompound semiconductorCS Industry Awardhigh volume manufacturingSiCplasma etchsilicon carbideEuropeindustrial

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