AIM Photonics, the American Institute for Manufacturing Integrated Photonics, has announced a patent and intellectual property licensing agreement with IBM. Dr. Michael Liehr (left), Chief Executive Officer at AIM Photonics, and IBM researcher, Bala Haran (right), show off the semiconductor industry’s first 7nm (nanometer) node test chips with functioning transistors. Courtesy of SUNY Poly. The collaboration is expected to provide a path for the development of new technologies and products that will further solidify the consortium’s position in the integrated photonics manufacturing ecosystem. Additionally, the intellectual property licensing agreement with IBM will help AIM Photonics establish standard processes in the development of silicon photonics assemblies. Industry and academic AIM Photonics members will access these technologies through a process design kit (PDK) and prototype development at the Rochester Test Assembly and Packaging (TAP) facility and the 300-mm-chip facility at SUNY Poly’s Albany campus. One of AIM Photonics’ primary goals is to make Rochester a technology hub for silicon photonics manufacturing and packaging, generating both growth and job opportunities for the city of Rochester, Monroe County, and the State as a whole. Through its membership, IBM will contribute to the development of AIM Photonics’ advanced integrated silicon photonics technology, packaging services, and other future offerings to make advanced technology available to AIM Photonics members and the wider technical community.