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EOS Joins the 3MF Consortium

Photonics.com
May 2017
WAKEFIELD, Mass., May 11, 2017 — The 3MF Consortium, an industry association created to develop and promote a new full-fidelity file format for 3D printing, has announced the membership of industrial 3D printing developer EOS.

"EOS additive manufacturing solutions allow manufacturers to shift from traditional tool-based, static manufacturing techniques to generative, flexible, more efficient industrial 3D printing methods," said Martin Steuer, business development manager at EOS. "The 3MF 3D file format plays an important role in additive manufacturing by helping to improve the efficiency and productivity of additive manufacturing solutions while eliminating the issues found with older file formats."

The 3MF Consortium was formed to close the gap between the capabilities of modern 3D printers and outdated file formats. The 3MF specification eliminates the problems associated with currently available file formats, resolving interoperability and functionality issues, enabling companies to focus more on innovation.

Founding members of the 3MF Consortium are 3D Systems; Autodesk Inc.; Dassault Systèmes SA.; EOS; FIT AG; GE Global Research; HP Inc.; Materialise; Microsoft Corp.; Shapeways Inc.; Siemens PLM Software; SLM Solutions Group AG; Stratasys; and Ultimaker.

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