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Eltek Targets High Density Interconnects with Laser Imaging Systems
Jul 2000
PETACH-TIKVA, Israel, July 18 -- Eltek Ltd., an Israeli manufacturer of printed circuit boards, will invest in High Density Interconnect technology after having researched the rarely used technology for the past two years, the company said.
Eltek will invest between $6 and $7 million in advanced laser-based machinery and facilities to build the capacity and capability to produce HDI products. Eltek bought an advanced Laser Drilling machine from ESI, and a Laser Direct Imaging system and an Automatic Optical Inspection system, both produced by Orbotech Ltd.
HDI technology decreases line width and spaces on printed circuit boards to .002 and holes to diameters of .003 (microvia holes). This technology makes it possible to keep dense, advanced components on the board while decreasing its size and weight, the company said.

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