PORTLAND, Ore., April 17 -- Electro Scientific Industries Inc. said that ThaiLin Semiconductor Corp., in Hsin-Chu, Taiwan, has purchased additional laser semiconductor processing systems. ThaiLin will use the tools in a new 300 mm wafer testing production line. The systems will ship during the first quarter of ESI's 2002 fiscal year, with shipments completed by August 31, 2001. ESI's laser semiconductor processing tools use a patented 1.3 µm wavelength laser that allows high levels of energy to be used to remove metal links without damaging the surrounding silicon. The 1.3 µm laser process gives semiconductor producers flexibility in front-end processing of metal memory link materials. The result is cleaner link cuts and a higher yield of quality product.