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Trikon Introduces New Orion Family For Copper Damascene Processes

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NEWPORT, Wales, May 31 -- Trikon Technologies Inc., a provider of semiconductor processing equipment, announced the availability of its new Orion family of ultra-low dielectric constant (k) materials for copper damascene processes at the 90 nm technology node, and below.     Orion is an organosilicate material deposited by chemical vapor deposition (CVD). It complements Trikon's Low k Flowfill dielectric material, currently used in production for aluminum gap-fill metalization. The Orion family incorporates integrated copper diffusion barriers, buried etch stops and dielectric layers to give...Read full article

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