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Indium Corp. Announces Solder Paste Price Increase

Photonics.com
Jun 2001
Clinton, N.Y., June 14 -- Indium Corp. of America, a developer of high-performance electronic assembly materials, has announced it will raise solder paste prices on June 30, 2001. The pricing plan calls for an increase of 12 - 15 percent across all paste product lines.
    "As a supplier to Electronic Manufacturing Service providers, we have experienced a significant and steady decline in solder paste prices without regard to the material's positive impact on bottom line costs. While some suppliers curtail funding for critical R&D and technical support programs, we continue investing in the ability to offer our customers increased productivity and enhanced manufacturing performance by leveraging these vital functions," said Charles Less, Indium's vice president of marketing.

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