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Ultratech Stepper, Varian Semiconductor and TEL Join Forces to Create Industry's First Sub-70 nm Technology Center
Jul 2001
SAN FRANCISCO, July 19 -- Ultratech Stepper Inc., Varian Semiconductor Equipment Associates Inc. and Tokyo Electron Limited (TEL) announced that they have joined forces to establish the industry's first advanced technology center dedicated to ultra-shallow junction formation for the sub-70 nm technology node. Upon completion, the Advanced Technology Center will feature the core process technologies needed to create a fully integrated solution for ultra-shallow junction formation. Each member of the alliance will contribute state-of-the-art equipment and technological expertise in their respective arena, namely: ion implant and plasma doping from Varian Semiconductor; thin-film deposition from TEL; and laser thermal processing from Verdant Technologies Inc., a division of Ultratech Stepper.

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