Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn Comments

Ultratech Stepper, Varian Semiconductor and TEL Join Forces to Create Industry's First Sub-70 nm Technology Center
Jul 2001
SAN FRANCISCO, July 19 -- Ultratech Stepper Inc., Varian Semiconductor Equipment Associates Inc. and Tokyo Electron Limited (TEL) announced that they have joined forces to establish the industry's first advanced technology center dedicated to ultra-shallow junction formation for the sub-70 nm technology node. Upon completion, the Advanced Technology Center will feature the core process technologies needed to create a fully integrated solution for ultra-shallow junction formation. Each member of the alliance will contribute state-of-the-art equipment and technological expertise in their respective arena, namely: ion implant and plasma doping from Varian Semiconductor; thin-film deposition from TEL; and laser thermal processing from Verdant Technologies Inc., a division of Ultratech Stepper.

News & Features

Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2018 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA,
x We deliver – right to your inbox. Subscribe FREE to our newsletters.