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3-D IC Bonding Process Licensing Development

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Ziptronix Inc. of Morrisville, N.C., a low-temperature oxide-bonding technology developer, is devising strategies for licensing its patented ZiBond and Direct Bond Interconnect technologies across the semiconductor supply chain. The IC bonding technologies will enable semiconductor manufacturers to quickly achieve high throughput, wafer-to-wafer or chip-to-water low-temperature oxide bonding for three-dimensional integrated circuits. Ziptronix says the technology could be implemented at all levels of the semiconductor chain and employed with slight modification of existing tools.

Photonics Spectra
Apr 2009
integrated circuitsoxide-bonding technologyPatent NewssemiconductorsSlices from the Breadboard

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