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3-D IC Bonding Process Licensing Development

Photonics Spectra
Apr 2009
Ziptronix Inc. of Morrisville, N.C., a low-temperature oxide-bonding technology developer, is devising strategies for licensing its patented ZiBond and Direct Bond Interconnect technologies across the semiconductor supply chain. The IC bonding technologies will enable semiconductor manufacturers to quickly achieve high throughput, wafer-to-wafer or chip-to-water low-temperature oxide bonding for three-dimensional integrated circuits. Ziptronix says the technology could be implemented at all levels of the semiconductor chain and employed with slight modification of existing tools.

integrated circuitsoxide-bonding technologyPatent NewssemiconductorSlices from the Breadboard

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