Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn Comments

3-D IC Bonding Process Licensing Development

Photonics Spectra
Apr 2009
Ziptronix Inc. of Morrisville, N.C., a low-temperature oxide-bonding technology developer, is devising strategies for licensing its patented ZiBond and Direct Bond Interconnect technologies across the semiconductor supply chain. The IC bonding technologies will enable semiconductor manufacturers to quickly achieve high throughput, wafer-to-wafer or chip-to-water low-temperature oxide bonding for three-dimensional integrated circuits. Ziptronix says the technology could be implemented at all levels of the semiconductor chain and employed with slight modification of existing tools.

integrated circuitsoxide-bonding technologyPatent NewssemiconductorSlices from the Breadboard

Terms & Conditions Privacy Policy About Us Contact Us
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2019 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA,

Photonics Media, Laurin Publishing
x Subscribe to Photonics Spectra magazine - FREE!
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.