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3M, EV Settle Patent Suit

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3M of St. Paul, Minn., and EV Group of St. Florian, Austria, have agreed to settle patent infringement litigation relating to systems for temporary wafer bonding, brought by EVG against 3M in the US District Court for the Southern District of New York. Under the terms of the mostly confidential settlement, 3M, its customers, and licensed suppliers of its wafer support system will continue to make and sell the system in global semiconductor and packaging markets.

Photonics.com
Dec 2008
GLOSSARY
photonics
The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
3MEmploymentEV Groupintellectual propertylitigationnanoNew YorkNews BriefspatentphotonicsPhotonics Tech BriefssemiconductorSouthern DistrictSt. FlorianSt. Paultemporary wafer bondingUS District Courtwafer support system

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